Methods and apparatuses for providing stacked-die devices

Details Methods and apparatuses for providing stacked-die devices Methods and apparatuses for providing stacked-die devices

2011-01-11

2011-01-11

Pham, Thanhha (Department: 2894)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S127000, C257SE21499

Reexamination Certificate

active

07867818

ABSTRACT:
Methods and apparatuses to provide a stacked-die device comprised of stacked sub-packages. For one embodiment of the invention, each sub-package has interconnections formed on the die-side of the substrate for interconnecting to another sub-package. The dies and associated wires are protected by an encapsulant leaving an upper portion of each interconnection exposed. For one embodiment of the invention the encapsulant is a stencil-printable encapsulant and the upper portion of the interconnection is exposed by use of a patterned stencil during application of the encapsulant.

REFERENCES:
patent: 5040052 (1991-08-01), McDavid
patent: 5422435 (1995-06-01), Takiar et al.
patent: 5726493 (1998-03-01), Yamashita et al.
patent: 6194250 (2001-02-01), Melton et al.
patent: 6326555 (2001-12-01), McCormack et al.
patent: 6388333 (2002-05-01), Taniguchi et al.
patent: 6414384 (2002-07-01), Lo et al.
patent: 6448506 (2002-09-01), Glenn et al.
patent: 6489676 (2002-12-01), Taniguchi et al.
patent: 6813157 (2004-11-01), Chang
patent: 2002/0000327 (2002-01-01), Juso et al.
patent: 2002/0025601 (2002-02-01), Liaw
patent: 2002/0066952 (2002-06-01), Taniguchi et al.
patent: 2002/0121687 (2002-09-01), Winderl
patent: 2002/0135057 (2002-09-01), Kurita
patent: 2002/0196650 (2002-12-01), Chang
patent: 2003/0042564 (2003-03-01), Taniguchi et al.
patent: 2004/0124518 (2004-07-01), Karnezos
patent: 2004/0262728 (2004-12-01), Sterrett et al.
patent: 2005/0121764 (2005-06-01), Mallik et al.
patent: 7-335783 (1994-06-01), None
patent: 2002-16182 (2000-06-01), None
patent: 2000178414 (2000-06-01), None
patent: 2003-007970 (2001-06-01), None
patent: 2001223227 (2001-08-01), None
patent: 2003-133480 (2001-10-01), None
patent: 2003-258009 (2002-03-01), None
patent: 2002-170906 (2002-06-01), None
patent: 2004-327855 (2003-04-01), None
patent: 461058 (2001-10-01), None
PCT Search Report mailed Dec. 6, 2005 for PCT/US2005/027103.

Affiliated with

Also associated with

Rating

Methods and apparatuses for providing stacked-die devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods and apparatuses for providing stacked-die devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and apparatuses for providing stacked-die devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2672685