Methods and apparatuses for controlling gas flow conductance...

Details Methods and apparatuses for controlling gas flow conductance... Methods and apparatuses for controlling gas flow conductance...

2006-12-20

2011-10-25

Kackar, Ram (Department: 1716)

Coating apparatus

Gas or vapor deposition

C118S692000, C118S7230AN, C156S345260, C156S345330, C216S067000, C427S569000

Reexamination Certificate

active

08043430

ABSTRACT:
Apparatuses are provided for controlling flow conductance of plasma formed in a plasma processing apparatus that includes an upper electrode opposite a lower electrode to form a gap therebetween. The lower electrode is adapted to support a substrate and coupled to a RF power supply. Process gas injected into the gap is excited into the plasma state during operation. The apparatus includes a ground ring that concentrically surrounds the lower electrode and has a set of slots formed therein, and a mechanism for controlling gas flow through the slots.

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