Methods and apparatus to form electronic components with at...

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S502000

Reexamination Certificate

active

07737006

ABSTRACT:
A method of manufacturing an electronic component comprising at least one n- or p-doped portion, comprising the steps of: co-depositing inorganic semi-conducting nanoparticles and dopant on a substrate, the nanoparticles being a group four element such as silicon or germanium; fusing the nanoparticles by heating to form a continuous layer; and subsequently; and, recrystallising the layer.

REFERENCES:
patent: 4003770 (1977-01-01), Janowiecki et al.
patent: 4940623 (1990-07-01), Bosna et al.
patent: 5114744 (1992-05-01), Cloutier et al.
patent: 5391841 (1995-02-01), Quick
patent: 5800611 (1998-09-01), Christensen
patent: 5866471 (1999-02-01), Beppu et al.
patent: 5876615 (1999-03-01), Predetechensky
patent: 5891528 (1999-04-01), Turek et al.
patent: 5989700 (1999-11-01), Krivopal
patent: 6021050 (2000-02-01), Ehman et al.
patent: 6076723 (2000-06-01), I-Tsung Pan
patent: 6086945 (2000-07-01), Kamata et al.
patent: 6224180 (2001-05-01), Pham-Van-Diep et al.
patent: 6251488 (2001-06-01), Miller et al.
patent: 6491969 (2002-12-01), Eldridge
patent: 6503831 (2003-01-01), Speakman
patent: 6518087 (2003-02-01), Furusawa et al.
patent: 6527843 (2003-03-01), Zaima et al.
patent: 6541354 (2003-04-01), Shimoda et al.
patent: 6641860 (2003-11-01), Kaiserman et al.
patent: 6645569 (2003-11-01), Cramer et al.
patent: 6689950 (2004-02-01), Cordaro
patent: 6767775 (2004-07-01), Yudasaka et al.
patent: 7063869 (2006-06-01), Yamazaki et al.
patent: 7176040 (2007-02-01), Sirringhaus et al.
patent: 7369122 (2008-05-01), Cross et al.
patent: 7378291 (2008-05-01), Yamazaki et al.
patent: 2001/0021760 (2001-09-01), Matsuki et al.
patent: 2002/0149656 (2002-10-01), Nohr et al.
patent: 2003/0047816 (2003-03-01), Dutta
patent: 2004/0137710 (2004-07-01), Grigoropoulos et al.
patent: 2005/0266154 (2005-12-01), Devos et al.
patent: 197 46 515 (1998-08-01), None
patent: 198 45 496 (2000-04-01), None
patent: 1 085 578 (2001-03-01), None
patent: 1 106 712 (2001-06-01), None
patent: 1 223 615 (2002-06-01), None
patent: WO 200059015 (2000-10-01), None
patent: WO 200059044 (2000-10-01), None
United States Patent and Trademark Office, “Office Action,” issued in connection with U.S. Appl. No. 10/854,450, mailed Jul. 25, 2008 (8 pages).
United States Patent and Trademark Office, “Office Action,” issued in connection with U.S. Appl. No. 10/854,450, mailed Jan. 7, 2009 (7 pages).
United States Patent and Trademark Office, “Office Action,” issued in connection with U.S. Appl. No. 10/854,450, mailed Jul. 9, 2009 (10 pages).
United States Patent and Trademark Office, “Office Action,” issued in connection with U.S. Appl. No. 10/854,450, mailed Jan. 25, 2010 (8 pages).
Fuller et al., “Ink-Jet Printed Nanoparticle Microelectromechanical Systems,” Journal of Microelectromechanical Systems, vol. 11, No. 1, Feb. 2002 (7 pages).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Methods and apparatus to form electronic components with at... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods and apparatus to form electronic components with at..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and apparatus to form electronic components with at... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4240881

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.