Methods and apparatus for wet cleaning electrode assemblies...

Details Methods and apparatus for wet cleaning electrode assemblies... Methods and apparatus for wet cleaning electrode assemblies...

2011-05-17

2011-05-17

Kornakov, Michael (Department: 1714)

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

C134S034000

Reexamination Certificate

active

07942973

ABSTRACT:
A method for cleaning an electrode assembly comprising a backing plate bonded to an electrode plate for a plasma processing assembly, the method including the steps of contacting the backing plate and electrode plate with a solvent; spraying the backing plate and electrode plate with water; ultrasonically cleaning the electrode assembly; enclosing the electrode assembly in a flushing fixture defined by a base plate having a plurality of liquid passages and a cover plate configured to cover the base plate, the cover plate including at least one liquid passage; and flushing the electrode assembly in the flushing fixture by introducing a flushing liquid under pressure through said at least one liquid passage in the cover plate.

REFERENCES:
patent: 6787111 (2004-09-01), Roach et al.
patent: 2003/0190870 (2003-10-01), Shih et al.
patent: 07-066180 (1995-03-01), None
patent: 18-179550 (2006-07-01), None
patent: WO 03/065433 (2003-08-01), None
International Search Report and Written Opinion dated Apr. 2, 2008 for International Application No. PCT/US2007/021628.
Chinese Office Action dated May 11, 2010 in corresponding Chinese Application.

Affiliated with

Also associated with

Rating

Methods and apparatus for wet cleaning electrode assemblies... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods and apparatus for wet cleaning electrode assemblies..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and apparatus for wet cleaning electrode assemblies... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2673548