Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1991-10-17
1994-01-11
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156653, 156655, 156657, 1566611, 427250, 427282, C23C 1400
Patent
active
052777499
ABSTRACT:
A layer of photoresist provides a stress relief (or cushion) layer between a lift-off polymer layer and a barrier of multi-level lift-off structures. When multiple evaporation steps are required using the same lift-off pattern, the adhesion between organosilicon and organic film is stressed by a first blanked metal film. To prevent delamination between the lift-off polymer layer and RIE barrier photoresist is applied on top of the lift-off polymer and sandwiched between the organosilicon and organic materials. This photoresist acts as a cushion and as an adhesion promoter to reduce delamination after the metal deposition(s).
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Griffith Jonathan H.
Kim John I.
Leong Thomas L.
Tilly William J.
Wacks Sari
Boles Donald M.
Dang Thi
International Business Machines - Corporation
Jones II Graham S.
Kaliko Joseph J.
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