Abrading – Work holder – Work rotating
Patent
1997-10-23
1999-06-29
Scherbel, David A.
Abrading
Work holder
Work rotating
451289, 451388, 451 5, 451 41, B24B 500
Patent
active
059160160
ABSTRACT:
Disclosed is a chemical mechanical polishing system. The system includes a mechanical arm and a carrier body that is configured to be coupled to the mechanical arm. The carrier body has a recessed portion for retaining a semiconductor wafer. The recessed portion has a carrier film that is in direct contact with a back side of the semiconductor wafer. The system further includes a plurality of pressure rings that are defined in the carrier body, such that the plurality of pressure rings are in direct contact with the carrier film. Each of the plurality of pressure rings are used to apply a selected pressure to the carrier film, such that the carrier film produces a back pressure against the back side of the semiconductor wafer. The back pressure is configured to be consistent with the selected pressure that is applied to each of the plurality of pressure rings. Whereby the selected pressure that is applied to each of the plurality of pressure rings controls a polishing rate in a plurality of concentric areas of the semiconductor wafer that correspond to the plurality of pressure rings.
REFERENCES:
patent: 5653622 (1997-08-01), Drill et al.
patent: 5762539 (1998-06-01), Nakashiba et al.
patent: 5791978 (1998-08-01), Cesna et al.
J. Hernandez, P. Wrschka, H. Sun, Y. Hsu, T. Kuan and G. Oehrlein, University of Albany, New York, NY; D. Hansen and J. King, Cybeq Nano Tech., Menlo Park, CA; and M. Fury of Rodel, Newark, DE. "Mechanistic Studies of Chemical-Mechanical Polishing of Al Films", Feb. 13-14, 1997, CMP-MIC Conf., '97 ISMIC, pp. 125-128.
Nguyen Dung Van
Scherbel David A.
VLSI Technology Inc.
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