Methods and apparatus for patterning a surface

Details Methods and apparatus for patterning a surface Methods and apparatus for patterning a surface

2006-08-15

2006-08-15

Norton, Nadine G. (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

Having liquid and vapor etching steps

C438S707000, C438S717000, C438S725000

Reexamination Certificate

active

07091127

ABSTRACT:
The present invention provides methods and apparatus for locally patterning surfaces. In one such method, an oxidizable thioether is adsorbed onto a conductive surface. The surface is then contacted with a fluid medium. A conducting stamp is then brought into contact with the fluid medium above the thioether-coated surface. Next, a potential is applied between the stamp and the surface. It is expected that the charge will be transferred through the medium to the coated surface along a shortest distance path, thereby locally oxidizing the thioether and effectively creating a negative patterned image of the conducting stamp on the surface. Remaining adsorbed thioether may then be used as a mask for standard etching or material addition procedures.

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