Methods and apparatus for magnetron sputtering

Details Methods and apparatus for magnetron sputtering Methods and apparatus for magnetron sputtering

2007-02-20

2007-02-20

McDonald, Rodney G. (Department: 1753)

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

C204S298180, C204S298190, C204S298200

Reexamination Certificate

active

10735987

ABSTRACT:
In one embodiment, a magnetron sputtering apparatus forms a closed plasma loop and an open plasma loop within the closed plasma loop. The open plasma loop allows for relatively uniform erosion on the face of a target by broadening the sputtered area of the target. The open plasma loop may be formed and swirled using a rotating magnetic array to average the target erosion.

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