Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate
2006-03-07
2006-03-07
Wilson, Allan R. (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
C257S690000, C257S784000, C438S106000
Reexamination Certificate
active
07009308
ABSTRACT:
A circuit that eliminates an off-chip inductive component connected between an integrated circuit (IC) arranged on a package and an external load comprises a package and an IC that is arranged on the package. A first bondwire arranged on the package has one end that communicates with the external load and an opposite end that communicates with the IC. A second bondwire located on the package has one end that communicates with the external load and an opposite end that communicates with the IC.
REFERENCES:
patent: 4113996 (1978-09-01), Sanderson
patent: 4605980 (1986-08-01), Hartranft et al.
patent: 5088016 (1992-02-01), Vinciarelli et al.
patent: 5181092 (1993-01-01), Atsumi
patent: 5428837 (1995-06-01), Bayruns et al.
patent: 5546038 (1996-08-01), Croft
patent: 5854504 (1998-12-01), Consiglio
patent: 5965920 (1999-10-01), Sung
patent: 6081164 (2000-06-01), Shigemori et al.
patent: 6107684 (2000-08-01), Busking et al.
patent: 6208225 (2001-03-01), Miller
patent: 6218706 (2001-04-01), Waggoner et al.
patent: 6232645 (2001-05-01), Belot
patent: 6317305 (2001-11-01), Dedic
patent: 6355970 (2002-03-01), Fujii
patent: 6813486 (2004-11-01), Sayers
patent: 2004/0012457 (2004-01-01), Soltan et al.
U.S. Appl. No. 10/397,454, filed Mar. 26, 2003, Jin Xiaodong.
Chien George
Jin Xiaodong
Tsai King Chun
Tse Lawrence
Wei Shuran
Harness & Dickey & Pierce P.L.C.
Wilson Allan R.
LandOfFree
Methods and apparatus for improving high frequency... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods and apparatus for improving high frequency..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and apparatus for improving high frequency... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3570375