Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate
2006-01-17
2006-01-17
Wilson, Allan R. (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
C257S690000, C257S784000, C438S106000
Reexamination Certificate
active
06987326
ABSTRACT:
An impedance matching circuit is provided for an IC arranged on a package that matches an impedance of an external load. The circuit includes a package, an IC that is arranged on the package, and an impedance matching circuit. The impedance matching circuit includes a first bondwire arranged on the package that has one end that communicates with the external load and an opposite end that communicates with said IC, a capacitance element arranged on the IC, and a second bondwire arranged on the package that has one end that communicates with the external load and an opposite end that communicates with one end of said capacitance element.
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U.S. Appl. No. 10/397,454, filed Mar. 26, 2003.
Chien George
Jin Xiaodong
Tsai King Chun
Tse Lawrence
Wei Shuran
Marvell International Ltd.
Wilson Allan R.
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