Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate
2005-12-20
2005-12-20
Wilson, Allan R. (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
C257S690000, C257S784000, C438S106000
Reexamination Certificate
active
06977444
ABSTRACT:
An input circuit for an integrated circuit (IC), which is mounted on a package having an input pin, rejects signal energy at a first frequency. A first bondwire arranged on the package has one end that communicates with the pin and an opposite end that communicates with components of the IC. A second bondwire located on the package has one end that communicates with the pin and an opposite end that communicates with a capacitance. The capacitance and an inductance of the first and second bondwires resonate at the first frequency to reject signal energy at the first frequency. Bondwires are also used to eliminate external components such as resonant components and impedance matching circuits to reduce cost.
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U.S. Appl. No. 10/397,454, filed Mar. 26, 2003 Xiaodong Jin.
Chien George
Jin Xiaodong
Tsai King Chun
Tse Lawrence
Wei Shuran
Marvell International Ltd.
Wilson Allan R.
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