Methods and apparatus for extending the effective thermal...

Static information storage and retrieval – Read/write circuit – Differential sensing

Reexamination Certificate

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C365S163000, C365S177000

Reexamination Certificate

active

08004919

ABSTRACT:
Apparatus and systems are provided for thermal regulation of a memory integrated circuit (“IC”). The apparatus and systems may include a thermal sensor on a memory IC, and a heating element coupled to the thermal sensor. The heating element is adapted to heat the memory IC in response to a signal from the thermal sensor. Other aspects are also provided.

REFERENCES:
patent: 4646266 (1987-02-01), Ovshinsky
patent: 4899180 (1990-02-01), Elhatem et al.
patent: 5177453 (1993-01-01), Russell et al.
patent: 5659270 (1997-08-01), Millen et al.
patent: 5751012 (1998-05-01), Wolstenholme
patent: 5835396 (1998-11-01), Zhang
patent: 6034882 (2000-03-01), Johnson
patent: 6055180 (2000-04-01), Gudesen
patent: 6185122 (2001-02-01), Johnson et al.
patent: 6373768 (2002-04-01), Woo et al.
patent: 6420215 (2002-07-01), Knall
patent: 6618295 (2003-09-01), Scheuerlein
patent: 6631085 (2003-10-01), Kleveland
patent: 6888750 (2005-05-01), Walker et al.
patent: 7081377 (2006-07-01), Cleeves
patent: 7106652 (2006-09-01), Scheuerlein
patent: 7148763 (2006-12-01), Sutardja
patent: 7173407 (2007-02-01), Marinca
patent: 7233024 (2007-06-01), Scheuerlein
patent: 7403423 (2008-07-01), Marotta et al.
patent: 7450456 (2008-11-01), Jain et al.
patent: 7504051 (2009-03-01), Sen
patent: 7646627 (2010-01-01), Hidaka
patent: 7656734 (2010-02-01), Thorp et al.
patent: 7812404 (2010-10-01), Herner et al.
patent: 2007/0114508 (2007-05-01), Herner
patent: 2009/0003109 (2009-01-01), Thorp et al.
Braun et al., “On-Chip Temperature Control Circuit Using Common Devices”, 2005, IEEE 2005 Custom Integrated Circuits Conference, pp. 215-218.
Office Action of U.S. Appl. No. 11/772,103 mailed Jun. 18, 2009.
Office Action of U.S. Appl. No. 11/772,097 mailed May 26, 2009.
Aug. 26, 2009 Reply to May 26, 2009 Office Action of U.S. Appl. No. 11/772,097.
Aug. 26, 2009 Reply to Jun. 18, 2009 Office Action of U.S. Appl. No. 11/772,103.
Notice of Allowance of U.S. Appl. No. 11/772,103 mailed Sep. 30, 2009.
Supplemental Notice of Allowance of U.S. Appl. No. 11/772,103 mailed Dec. 1, 2009.
Notice of Allowance of U.S. Appl. No. 11/772,097 mailed Dec. 15, 2009.
Knall, N. Johan, U.S. Appl. No. 09/560,626, filed Apr. 28, 2000.
Johnson, Mark G., U.S. Appl. No. 09/638,428, filed Aug. 14, 2000.
Naji et al., “A 256 kb 3.0V 1T1MT J Nonvolatile Magnetoresistive RAM”, Feb. 6, 2001, Digest of Technical Papers of the 2001 IEEE International Solid-State Circuits Conference, ISSCC 2001/Session 7/Technology Directions: Advanced Technologies/7.6, pp. 122-123, 438.
Naji et al., “A 256 kb 3.0V 1T1MT J Nonvolatile Magnetoresistive RAM”, ISSCC 2001 Visuals Supplement, Session 7/Technology Directions: Advanced Technologies/7.6, pp. 94-95 and 404-405.
Notice of Allowance of U.S. Appl. No. 11/772,097 mailed Apr. 2, 2010.
Comments on Reasons for Allowance of U.S. Appl. No. 11/772,097 mailed Apr. 15, 2010.

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