Electrolysis: processes – compositions used therein – and methods – Electrolytic erosion of a workpiece for shape or surface... – Simple alternating current
Reexamination Certificate
2006-12-26
2006-12-26
King, Roy (Department: 1742)
Electrolysis: processes, compositions used therein, and methods
Electrolytic erosion of a workpiece for shape or surface...
Simple alternating current
C204S286100, C204S298080, C204S298280, C204S242000, C204S22400M, C204S22400M, C204S212000, C204S230200, C205S659000, C205S663000
Reexamination Certificate
active
07153410
ABSTRACT:
Methods and apparatuses for electrochemical-mechanical processing of microelectronic workpieces. One embodiment of an electrochemical processing apparatus in accordance with the invention comprises a workpiece holder configured to receive a microelectronic workpiece, a workpiece electrode, a first remote electrode, and a second remote electrode. The workpiece electrode is configured to contact a processing side of the workpiece when the workpiece is received in the workpiece holder. The first and second remote electrodes are spaced apart from the workpiece holder. The apparatus can also include an AC power supply, a DC power supply, and a switching assembly. The switching assembly is coupled to the workpiece electrode, the first remote electrode, the second remote electrode, the AC power supply, and the DC power supply. In operation, the switching assembly couples the AC power supply and/or the DC power supply to the workpiece electrode, the first remote electrode, and/or the second remote electrode for plating, deplating and/or mechanically removing material.
REFERENCES:
patent: 2315695 (1943-04-01), Faust
patent: 2516105 (1950-07-01), der Mateosian
patent: 3239439 (1966-03-01), Helmke
patent: 3334210 (1967-08-01), Williams et al.
patent: 4839005 (1989-06-01), Katsumoto et al.
patent: 5098533 (1992-03-01), Duke et al.
patent: 5162248 (1992-11-01), Dennison et al.
patent: 5244534 (1993-09-01), Yu et al.
patent: 5300155 (1994-04-01), Sandhu et al.
patent: 5344539 (1994-09-01), Shinogi et al.
patent: 5562529 (1996-10-01), Kishii et al.
patent: 5567300 (1996-10-01), Datta et al.
patent: 5575885 (1996-11-01), Hirabayashi et al.
patent: 5618381 (1997-04-01), Doan et al.
patent: 5624300 (1997-04-01), Kishii et al.
patent: 5676587 (1997-10-01), Landers et al.
patent: 5681423 (1997-10-01), Sandhu et al.
patent: 5780358 (1998-07-01), Zhou et al.
patent: 5807165 (1998-09-01), Uzoh et al.
patent: 5840629 (1998-11-01), Carpio
patent: 5843818 (1998-12-01), Joo et al.
patent: 5846398 (1998-12-01), Carpio
patent: 5863307 (1999-01-01), Zhou et al.
patent: 5888866 (1999-03-01), Chien
patent: 5897375 (1999-04-01), Watts et al.
patent: 5911619 (1999-06-01), Uzoh et al.
patent: 5930699 (1999-07-01), Bhatia
patent: 5934980 (1999-08-01), Koos et al.
patent: 5952687 (1999-09-01), Kawakubo et al.
patent: 5954975 (1999-09-01), Cadien et al.
patent: 5954997 (1999-09-01), Kaufman et al.
patent: 5972792 (1999-10-01), Hudson
patent: 5993637 (1999-11-01), Hisamatsu et al.
patent: 6001730 (1999-12-01), Farkas et al.
patent: 6007695 (1999-12-01), Knall et al.
patent: 6010964 (2000-01-01), Glass
patent: 6024856 (2000-02-01), Haydu et al.
patent: 6033953 (2000-03-01), Aoki et al.
patent: 6039633 (2000-03-01), Chopra
patent: 6046099 (2000-04-01), Cadien et al.
patent: 6051496 (2000-04-01), Jang
patent: 6060386 (2000-05-01), Givens
patent: 6060395 (2000-05-01), Skrovan et al.
patent: 6063306 (2000-05-01), Kaufman et al.
patent: 6066030 (2000-05-01), Uzoh
patent: 6066559 (2000-05-01), Gonzalez et al.
patent: 6068787 (2000-05-01), Grumbine et al.
patent: 6083840 (2000-07-01), Mravic et al.
patent: 6100197 (2000-08-01), Hasegawa
patent: 6103096 (2000-08-01), Datta et al.
patent: 6103628 (2000-08-01), Talieh
patent: 6103636 (2000-08-01), Zahorik et al.
patent: 6115233 (2000-09-01), Seliskar et al.
patent: 6117781 (2000-09-01), Lukanc et al.
patent: 6121152 (2000-09-01), Adams et al.
patent: 6132586 (2000-10-01), Adams et al.
patent: 6143155 (2000-11-01), Adams et al.
patent: 6162681 (2000-12-01), Wu
patent: 6171467 (2001-01-01), Weihs et al.
patent: 6174425 (2001-01-01), Simpson et al.
patent: 6176992 (2001-01-01), Talieh
patent: 6180947 (2001-01-01), Stickel et al.
patent: 6187651 (2001-02-01), Oh
patent: 6190494 (2001-02-01), Dow
patent: 6196899 (2001-03-01), Chopra et al.
patent: 6197182 (2001-03-01), Kaufman et al.
patent: 6206756 (2001-03-01), Chopra et al.
patent: 6218309 (2001-04-01), Miller et al.
patent: 6250994 (2001-06-01), Chopra et al.
patent: 6259128 (2001-07-01), Adler et al.
patent: 6273786 (2001-08-01), Chopra et al.
patent: 6276996 (2001-08-01), Chopra
patent: 6280581 (2001-08-01), Cheng
patent: 6287974 (2001-09-01), Miller
patent: 6299741 (2001-10-01), Sun et al.
patent: 6303956 (2001-10-01), Sandhu et al.
patent: 6313038 (2001-11-01), Chopra et al.
patent: 6322422 (2001-11-01), Satou
patent: 6328632 (2001-12-01), Chopra
patent: 6368184 (2002-04-01), Beckage
patent: 6368190 (2002-04-01), Easter et al.
patent: 6379223 (2002-04-01), Sun et al.
patent: 6395607 (2002-05-01), Chung
patent: 6416647 (2002-07-01), Dordi et al.
patent: 6433929 (2002-08-01), Sasaki
patent: 6455370 (2002-09-01), Lane
patent: 6461911 (2002-10-01), Ahn et al.
patent: 6464855 (2002-10-01), Chadda et al.
patent: 6504247 (2003-01-01), Chung
patent: 6620037 (2003-09-01), Kaufman et al.
patent: 6689258 (2004-02-01), Lansford et al.
patent: 6693036 (2004-02-01), Nogami et al.
patent: 6722942 (2004-04-01), Lansford et al.
patent: 6736952 (2004-05-01), Emesh et al.
patent: 6753250 (2004-06-01), Hill et al.
patent: 6776693 (2004-08-01), Duboust et al.
patent: 6780772 (2004-08-01), Uzoh et al.
patent: 6848970 (2005-02-01), Manens et al.
patent: 6852630 (2005-02-01), Basol et al.
patent: 6867136 (2005-03-01), Basol et al.
patent: 6881664 (2005-04-01), Catabay et al.
patent: 6893328 (2005-05-01), So
patent: 2001/0025976 (2001-10-01), Lee
patent: 2001/0036746 (2001-11-01), Sato et al.
patent: 2002/0052126 (2002-05-01), Lee et al.
patent: 2002/0070126 (2002-06-01), Sato et al.
patent: 2002/0104764 (2002-08-01), Banerjee et al.
patent: 2002/0115283 (2002-08-01), Ho et al.
patent: 2003/0064669 (2003-04-01), Basol et al.
patent: 2003/0178320 (2003-09-01), Liu et al.
patent: 2004/0192052 (2004-09-01), Mukherjee et al.
patent: 2004/0259479 (2004-12-01), Sevilla
patent: 2005/0059324 (2005-03-01), Lee et al.
patent: 2005/0133379 (2005-06-01), Basol et al.
patent: 2005/0173260 (2005-08-01), Basol et al.
patent: 2005/0178743 (2005-08-01), Manens et al.
patent: 0459397 (1991-12-01), None
patent: 0459397 (1991-12-01), None
patent: 1 123 956 (2001-08-01), None
patent: 1-241129 (1989-09-01), None
patent: 2001077117 (2001-03-01), None
patent: WO 00/26443 (2000-05-01), None
patent: WO 00/28586 (2000-05-01), None
patent: WO 00/32356 (2000-06-01), None
patent: WO 00/59008 (2000-10-01), None
patent: WO 00/59682 (2000-10-01), None
patent: WO 02/064314 (2002-08-01), None
U.S. Appl. No. 09/651,779, filed Aug. 30, 2000, Moore.
U.S. Appl. No. 09/651,808, filed Aug. 30, 2000, Chopra et al.
U.S. Appl. No. 09/653,392, filed Aug. 31, 2000, Chopra et al.
U.S. Appl. No. 09/887,767, filed Jun. 21, 2001, Lee et al.
U.S. Appl. No. 09/888,002, filed Jun. 21, 2001, Lee et al.
U.S. Appl. No. 09/888,084, filed Jun. 21, 2001, Lee et al.
U.S. Appl. No. 10/230,463, filed Aug. 29, 2002, Lee et al.
U.S. Appl. No. 10/230,602, filed Aug. 29, 2002, Chopra.
U.S. Appl. No. 10/230,628, filed Aug. 29, 2002, Lee et al.
U.S. Appl. No. 10/230,970, filed Aug. 29, 2002, Lee et al.
U.S. Appl. No. 10/230,972, filed Aug. 29, 2002, Lee et al.
U.S. Appl. No. 10/230,973, filed Aug. 29, 2002, Lee et al.
Frankenthal, R.P. and Eaton, D.H., “Electroetching of Platinum in the Titanium-Platinum-Gold Metallization on Silicon Integrated Circuits,”Journal of The Electrochemical Society, vol. 123, No. 5, pp. 703-706, May 1976.
Bernhardt, A.F., Contolini, R.J., Mayer, S.T., “Electrochemical Planarization for Multi-Level Metallization of Microcircuitry,”CircuiTree Journal, vol. 8, No. 10, pp. 38, 40, 42, 44, 46, 48, Oct 1995.
McGraw-Hill,Concise Encyclopedia of Science&Technology, Sybil P. Parker, Editor in Chief, Fourth Edition, p. 367, McGraw-Hill, New York, New York, 1998, no month.
Huang, C.S. et al., “A Novel UV Baking Process to Improve DUV Photoresist Hardness,” 1999 International Symposium on VLSI Technology, Systems, and Applications: Proceedings of Technical Papers: Jun. 8-10, 1999, Taipei, Taiwan, pp. 135-138, IEEE, Aug. 1, 1999.
ATMI, Table of Contents, Adapted from a presentation at the Semicon West '99 Low Dielectric Materials Technology Conference,
Doan Trung T.
Lee Whonchee
Meikle Scott G.
Moore Scott E.
King Roy
Micro)n Technology, Inc.
Perkins Coie LLP
Zheng Lois
LandOfFree
Methods and apparatus for electrochemical-mechanical... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods and apparatus for electrochemical-mechanical..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and apparatus for electrochemical-mechanical... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3713272