Methods and apparatus for determining the endpoint of a...

Details Methods and apparatus for determining the endpoint of a... Methods and apparatus for determining the endpoint of a...

2005-03-28

2009-08-25

Meeks, Timothy H (Department: 1792)

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

C134S022100, C427S008000, C427S009000, C427S569000

Reexamination Certificate

active

07578301

ABSTRACT:
A method of determining an endpoint of a process by measuring a thickness of a layer, the layer being deposited on the surface by a prior process is disclosed. The method includes providing a sensor that is coplanar with the surface, wherein the sensor is configured to measure the thickness. The method also includes exposing the plasma chamber to a plasma, wherein the thickness is changed by the exposing, and determining the thickness as a function of time. The method further includes ascertaining a steady state condition in the thickness, the steady state condition being characterized by a substantially stable measurement of the thickness, a start of the steady state condition representing the endpoint.

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