Methods and apparatus for determining pad height for a...

Details Methods and apparatus for determining pad height for a... Methods and apparatus for determining pad height for a...

2006-06-06

2006-06-06

Andujar, Leonardo (Department: 2826)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S015000

Reexamination Certificate

active

07056819

ABSTRACT:
Methods and apparatus for performing a wire-bonding operation in an integrated circuit are disclosed. The positions of at least one height-sensing pad and at least one bond pad are determined on a top surface of an integrated circuit die. The height-sensing pad is electrically isolated from the die circuitry and the bond pad is electrically connected to the die circuitry. A bonding tool is lowered to the height-sensing pad, and a height coordinate of the height-sensing pad is then determined. Finally, the bond pad is wire-bonded to a leadframe utilizing the height coordinate of the height-sensing pad.

REFERENCES:
patent: 5037023 (1991-08-01), Akiyama et al.
patent: 6080651 (2000-06-01), Takahashi et al.
patent: 6405357 (2002-06-01), Chao et al.

Affiliated with

Also associated with

Rating

Methods and apparatus for determining pad height for a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods and apparatus for determining pad height for a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and apparatus for determining pad height for a... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3649683