Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2011-03-08
2011-03-08
Lindsay, Jr., Walter L (Department: 2812)
Semiconductor device manufacturing: process
With measuring or testing
Reexamination Certificate
active
07901953
ABSTRACT:
In some aspects, a method is provided for detecting a void in a test structure that comprises (a) measuring a resistance of the test structure; (b) applying a stress to the test structure at increasing levels until at least one of: (i) the measured resistance of the test structure exceeds a predetermined resistance threshold; and (ii) the stress level reaches a predetermined stress maximum; (c) detecting a void if the measured resistance of the test structure exceeds the predetermined resistance threshold; and (d) determining that the test structure is void free if the stress level reaches the predetermined stress maximum without the measured resistance of the test structure exceeding the predetermined resistance threshold. Numerous other aspects are provided.
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Oemardani Shiany
Smayling Karl F.
Smayling Michael C.
Applied Materials Inc.
Dugan & Dugan PC
Lindsay, Jr. Walter L
Stevenson Andre′ C
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