Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate
2006-08-01
2006-08-01
Thompson, A. M. (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Nanotechnology related integrated circuit design
C716S030000, C716S030000, C716S030000
Reexamination Certificate
active
07086024
ABSTRACT:
A method for defining and producing a power grid structure of an IC having diagonal power and ground stripes. Stripes are placed in a 45° or 135° diagonal direction in relation to an IC layout's x-coordinate axis so that the stripes will be placed in a 45° or 135° diagonal direction, respectively, in relation to the bottom boundary of the resulting IC. The diagonal power and ground stripes are beneficial to diagonal signal wiring. The stripes may be placed across one layer of the IC or across more than one layer of the IC. The diagonal power stripes may have varying widths and/or varying spacing widths on a layer of the IC. The diagonal ground stripes may have varying widths and/or varying spacing widths on a layer of the IC.
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Fujimura Akira
Hsu Hengfu
Teig Steven
Cadence Design Systems Inc.
Dimyan Magid Y.
Stattler Johansen & Adeli LLP
Thompson A. M.
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