Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...
Patent
1997-10-21
2000-12-26
Gupta, Yogendra
Cleaning compositions for solid surfaces, auxiliary compositions
Cleaning compositions or processes of preparing
For cleaning a specific substrate or removing a specific...
510176, 510435, 510488, 134 2, 134 3, C11D 904, C11D 1708, C11D 1500
Patent
active
061659568
ABSTRACT:
A cleaning solution, method, and apparatus for cleaning semiconductor substrates after chemical mechanical polishing of copper films is described. The present invention includes a cleaning solution which combines deionized water, an organic compound, and a fluoride compound in an acidic pH environment for cleaning the surface of a semiconductor substrate after polishing a copper layer. Such methods of cleaning semiconductor substrates after copper CMP alleviate the problems associated with brush loading and surface and subsurface contamination.
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Hymes Diane J.
Krusell Wilbur C.
Zhang Liming
Zhao Yuexing
Gupta Yogendra
Lam Research Corporation
Webb Gregory E.
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