Methods and apparatus for cleaning semiconductor devices

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

Reexamination Certificate

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C438S727000, C438S728000, C438S730000, C438S732000

Reexamination Certificate

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10918047

ABSTRACT:
Methods and apparatus for cleaning a semiconductor device are disclosed. A disclosed method comprises forming a capping layer on top of a substrate including a bottom interconnect layer; depositing and patterning an insulating layer on the capping layer to form a damascene structure; etching a portion of the capping layer exposed by the damascene structure; and (d) removing polymers and copper impurities due to the etching by using a HF vapor gas.

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Wolf, Silicon Processing for the VLSI Era, 2002, Lattice Press, vol. 4, p. 643.
Definition of the term “solution” using http://dictionary.reference.com/browse/solution ; 2 pages; 2006.

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