Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate
2007-12-25
2007-12-25
Tran, Binh X. (Department: 1765)
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
C438S727000, C438S728000, C438S730000, C438S732000
Reexamination Certificate
active
10918047
ABSTRACT:
Methods and apparatus for cleaning a semiconductor device are disclosed. A disclosed method comprises forming a capping layer on top of a substrate including a bottom interconnect layer; depositing and patterning an insulating layer on the capping layer to form a damascene structure; etching a portion of the capping layer exposed by the damascene structure; and (d) removing polymers and copper impurities due to the etching by using a HF vapor gas.
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Definition of the term “solution” using http://dictionary.reference.com/browse/solution ; 2 pages; 2006.
Dongbu Electronics Co. Ltd.
Saliwanchik Lloyd & Saliwanchik
Tran Binh X.
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