Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent
1997-04-24
1999-07-13
Nguyen, Vinh P.
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
324760, G01R 3102
Patent
active
059231815
ABSTRACT:
Methods and apparatus are set forth for burn-in stressing and simultaneous testing of a plurality of semiconductor device chips laminated together in a stack configuration to define a multichip module. Testing is facilitated by connecting temporary interconnect wiring to an access surface of the multichip module. This temporary interconnect wiring electrically interconnects at least some semiconductor device chips within the module. Prior to burn-in stressing and testing, a separate electrical screening step occurs to identify any electrical defect in the connection between the temporary interconnect wiring and the multichip module. If an electrical defect is identified, various techniques for removing or isolating the defect are presented. Thereafter, burn-in stressing and simultaneous testing of the semiconductor chips within the multichip module occurs using the temporary interconnect wiring. Various alignment and test fixtures are described for facilitating this burn-in and simultaneous testing of the semiconductor chips within the multichip module.
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Beilstein, Jr. Kenneth Edward
Bertin Claude Louis
Dubois Dennis Charles
Howell Wayne John
Kelley, Jr. Gordon Arthur
International Business Machine Corporation
Nguyen Vinh P.
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