Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2005-08-09
2005-08-09
Huynh, Andy (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S106000, C438S107000, C438S108000, C438S125000
Reexamination Certificate
active
06927098
ABSTRACT:
A method for increasing the bonding strength between a die and a housing for the die is described where a micro-electromechanical system (MEMS) device is formed on the die. The method comprises depositing a plurality of clusters of contact material onto a bottom surface of the housing, placing the die onto the clusters, and subjecting the housing, the clustered contacts, and the die to a thermocompression bonding process.
REFERENCES:
patent: 4933808 (1990-06-01), Horton et al.
patent: 5109320 (1992-04-01), Bourdelaise et al.
patent: 5627406 (1997-05-01), Pace
patent: 5904499 (1999-05-01), Pace
patent: 6316840 (2001-11-01), Otani
patent: 6388203 (2002-05-01), Rinne et al.
patent: 6459150 (2002-10-01), Wu et al.
patent: 6500760 (2002-12-01), Peterson et al.
patent: 6519075 (2003-02-01), Carr et al.
patent: 6536653 (2003-03-01), Wang et al.
patent: 6550337 (2003-04-01), Wagner et al.
patent: 6613605 (2003-09-01), Pace
patent: 6639313 (2003-10-01), Martin et al.
patent: 6768207 (2004-07-01), Tao et al.
patent: 2002/0185715 (2002-12-01), Honer et al.
patent: 2003/0095343 (2003-05-01), Feldman
patent: 2003/0122243 (2003-07-01), Lee et al.
patent: 2003/0122244 (2003-07-01), Lin et al.
patent: 2003/0122246 (2003-07-01), Lin et al.
patent: 2003/0124767 (2003-07-01), Lee et al.
patent: 2003/0124835 (2003-07-01), Lin et al.
patent: 1 157 967 (2001-11-01), None
patent: 2001004473 (2001-01-01), None
patent: WO 01/50106 (2001-07-01), None
patent: WO 02/064497 (2002-08-01), None
International Search Report dated Sep. 15, 2004, Application No. PCT/US2004/014268, 15 pages.
Curtis Harlan L.
DCamp Jon B.
Dunaway Lori A.
Glenn Max C.
Honeywell International , Inc.
Huynh Andy
Luxton, Esq. Matthew
LandOfFree
Methods and apparatus for attaching MEMS devices to housing does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods and apparatus for attaching MEMS devices to housing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and apparatus for attaching MEMS devices to housing will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3521226