Methods and apparatus for aligning a wafer in which multiple...

Details Methods and apparatus for aligning a wafer in which multiple... Methods and apparatus for aligning a wafer in which multiple...

2006-06-27

2006-06-27

Lauchman, Layla G. (Department: 2877)

Optics: measuring and testing

By alignment in lateral direction

With registration indicia

C356S400000

Reexamination Certificate

active

07068371

ABSTRACT:
A wafer, having alignment marks formed thereon, is aligned by radiating a first light beam onto the alignment marks so as to generate a first diffracted light beam. The first diffracted light beam is sensed at a first position. A second light beam is radiated onto the alignment marks so as to generate a second diffracted light beam. The second diffracted light beam is sensed at a second position. A correction value is calculated based on a first difference between the first position and a first predetermined position and a second difference is calculated based on a second difference between the second position and a second predetermined position. The wafer is aligned based on the correction value.

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