Method to use a laser to perform the edge clean operation on...

Details Method to use a laser to perform the edge clean operation on... Method to use a laser to perform the edge clean operation on...

2005-04-05

2005-04-05

Kornakov, M. (Department: 1746)

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

C134S001000, C134S033000, C134S037000, C216S063000, C216S065000, C219S121600

Reexamination Certificate

active

06874510

ABSTRACT:
A method for performing the edge clean operation on a semiconductor wafer. A laser beam is used to accurately clean the edge of the wafer. The wafer is clamped concentrically to a chuck and rotated at a selectable speed, preferably in the range of 10 rpm to 1,000 rpm. A laser beam of variable power is directed onto toward the edge of the wafer at an oblique angle through a nozzle through which an inert purge gas is simultaneously passed. The laser beam removes unwanted deposits at the edge of the wafer and the gas is used to blow away the residue and prevent slag buildup on other parts of the wafer. The process is preferably carried out in an exhausted chamber.

REFERENCES:
patent: 5669979 (1997-09-01), Elliott et al.
patent: 5814156 (1998-09-01), Elliott et al.
patent: 6376797 (2002-04-01), Piwczyk et al.
patent: 6423928 (2002-07-01), Piwczyk
patent: 6454877 (2002-09-01), Kumar et al.
patent: 6683277 (2004-01-01), Millard et al.
patent: 6701942 (2004-03-01), Lee et al.
patent: 6-335790 (1994-06-01), None
patent: 2000-348396 (2000-12-01), None

Affiliated with

Also associated with

Rating

Method to use a laser to perform the edge clean operation on... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method to use a laser to perform the edge clean operation on..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method to use a laser to perform the edge clean operation on... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3418468