Method to selectively identify reliability risk die based on...

Semiconductor device manufacturing: process – With measuring or testing

Reexamination Certificate

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C257S375000, C257SE21135

Reexamination Certificate

active

07390680

ABSTRACT:
A method and system for selectively identifying reliability risk die based on characteristics of local regions on a wafer by computing particle sensitive yield and using the particle sensitive yield to identify reliability risk die. Specifically, a bin characteristics database which identifies hard and soft bins that are sensitive to different failure mechanisms is maintained, and the bin characteristics database is used to compute particle sensitive yield. It is determined whether the particle sensitive yield of the local region around the current die is less than a pre-set threshold, and the die is downgraded if the particle sensitive yield of the local region around the current die is less than the pre-set threshold. If the particle sensitive yield of the local region around the current die is not less than the pre-set threshold, the die is not downgraded.

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Barnett, Thomas S. et al., “Burn-In Failures and Local Region Yield: An Integrated Yield-Reliability Model”, Auburn University.
Barnett, Thomas S. et al., “Yield-Reliability Modeling: Experimental Verification and Application to Burn-In Reduction”, Auburn University.

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