Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2008-06-24
2008-06-24
Lebentritt, Michael S. (Department: 2812)
Semiconductor device manufacturing: process
With measuring or testing
C257S375000, C257SE21135
Reexamination Certificate
active
07390680
ABSTRACT:
A method and system for selectively identifying reliability risk die based on characteristics of local regions on a wafer by computing particle sensitive yield and using the particle sensitive yield to identify reliability risk die. Specifically, a bin characteristics database which identifies hard and soft bins that are sensitive to different failure mechanisms is maintained, and the bin characteristics database is used to compute particle sensitive yield. It is determined whether the particle sensitive yield of the local region around the current die is less than a pre-set threshold, and the die is downgraded if the particle sensitive yield of the local region around the current die is less than the pre-set threshold. If the particle sensitive yield of the local region around the current die is not less than the pre-set threshold, the die is not downgraded.
REFERENCES:
patent: 5642307 (1997-06-01), Jernigan
patent: 6219908 (2001-04-01), Farnworth et al.
patent: 6393602 (2002-05-01), Atchison et al.
patent: 6477685 (2002-11-01), Lovelace
patent: 6483938 (2002-11-01), Hennessey et al.
patent: 6507933 (2003-01-01), Kirsch et al.
patent: 6678668 (2004-01-01), Fisher et al.
patent: 7194366 (2007-03-01), Singh et al.
Barnett, Thomas S. et al., “Burn-In Failures and Local Region Yield: An Integrated Yield-Reliability Model”, Auburn University.
Barnett, Thomas S. et al., “Yield-Reliability Modeling: Experimental Verification and Application to Burn-In Reduction”, Auburn University.
Abercrombie David
Cota Kevin
Gonzales Ramon
Rehani Manu
Lebentritt Michael S.
LSI Corporation
Stevenson Andre′
Trexler Bushnell Giangiorgi & Blackstone Ltd.
LandOfFree
Method to selectively identify reliability risk die based on... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method to selectively identify reliability risk die based on..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method to selectively identify reliability risk die based on... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2807074