Method to remove fluorine residue from bond pads

Details Method to remove fluorine residue from bond pads Method to remove fluorine residue from bond pads

2006-06-06

2006-06-06

Deo, Duy-Vu N. (Department: 1765)

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

C134S001200, C134S001300, C438S710000, C438S714000, C438S720000, C438S722000

Reexamination Certificate

active

07055532

ABSTRACT:
The process of the present invention comprises reactive ion etching of AlxFyOzoxide deposits on aluminum-containing bond pads using feed gases, such as, SF6/CF4/Ar or Cl2/BCL3/Ar. whose active plasma etches the AlxFyOzoxide deposits by physical etching and chemical etching for more complete removal of the AlxFyOzoxide deposits.

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