Method to reduce parastic capacitance in a metal high...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation

Reexamination Certificate

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C438S184000, C438S230000, C438S267000, C438S303000, C438S304000, C438S446000, C438S592000, C438S595000

Reexamination Certificate

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07855135

ABSTRACT:
A method is disclosed to reduce parasitic capacitance in a metal high dielectric constant (MHK) transistor. The method includes forming a MHK gate stack upon a substrate, the MHK gate stack having a bottom layer of high dielectric constant material, a middle layer of metal, and a top layer of one of amorphous silicon or polycrystalline silicon. The method further forms a depleted sidewall layer on sidewalls of the MHK gate stack so as to overlie the middle layer and the top layer, and not the bottom layer. The depleted sidewall layer is one of amorphous silicon or polycrystalline silicon. The method further forms an offset spacer layer over the depleted sidewall layer and over exposed surfaces of the bottom layer.

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patent: 6448613 (2002-09-01), Yu
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patent: 7012027 (2006-03-01), Perng et al.
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patent: 2006/0022270 (2006-02-01), Boyd et al.

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