Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2006-07-11
2010-11-23
Wilczewski, Mary (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S686000, C257S691000, C257S723000, C257S735000, C257S777000, C257SE21507, C257SE21508, C438S109000, C438S112000, C438S455000, C438S611000, C438S745000
Reexamination Certificate
active
07838971
ABSTRACT:
An apparatus and a method for packaging semiconductor devices. Disclosed are multi-die packaging apparatuses and techniques, especially useful for integrated circuit dice involving insulative substrates, such as silicon-on-insulator (SOI), where grounding of a base layer is not reasonably practical. Disclosed is a means for effectively grounding all layers of an integrated circuit device regardless of whether the device makes direct contact with a die-attach paddle.
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Atmel Corporation
Duong Khanh B
Schwegman Lundberg & Woessner, P.A.
Wilczewski Mary
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