Method to provide substrate-ground coupling for...

Details Method to provide substrate-ground coupling for... Method to provide substrate-ground coupling for...

2006-07-11

2010-11-23

Wilczewski, Mary (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S686000, C257S691000, C257S723000, C257S735000, C257S777000, C257SE21507, C257SE21508, C438S109000, C438S112000, C438S455000, C438S611000, C438S745000

Reexamination Certificate

active

07838971

ABSTRACT:
An apparatus and a method for packaging semiconductor devices. Disclosed are multi-die packaging apparatuses and techniques, especially useful for integrated circuit dice involving insulative substrates, such as silicon-on-insulator (SOI), where grounding of a base layer is not reasonably practical. Disclosed is a means for effectively grounding all layers of an integrated circuit device regardless of whether the device makes direct contact with a die-attach paddle.

REFERENCES:
patent: 6509639 (2003-01-01), Lin
patent: 6599779 (2003-07-01), Shim, II et al.
patent: 6744126 (2004-06-01), Chiang
patent: 6759307 (2004-07-01), Yang
patent: 6857470 (2005-02-01), Park et al.
patent: 7005730 (2006-02-01), Verma et al.
patent: 7129113 (2006-10-01), Lin et al.
patent: 2001/0002321 (2001-05-01), Castro
patent: 2005/0002167 (2005-01-01), Hsuan et al.
patent: 2005/0046041 (2005-03-01), Tsai
patent: 2005/0133916 (2005-06-01), Karnezos
patent: 2006/0006553 (2006-01-01), Fuller et al.
patent: 2006/0055009 (2006-03-01), Shim, II et al.
patent: 2006/0118927 (2006-06-01), Verma et al.
patent: WO-2008008586 (2008-01-01), None
PCT Application No. PCT/US07/70994, International Search Report mailed Jan. 31, 2008, 2 pgs.
PCT Application No. PCT/US07/70994, Written Opinion mailed Jan. 31, 2008, 5 pgs.

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