Method to protect alignment mark in CMP process

Details Method to protect alignment mark in CMP process Method to protect alignment mark in CMP process

1997-06-02

1999-07-13

Picardat, Kevin M.

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

438460, 438108, 438124, H01L 2146, H01L 21301, H01L 2178

Patent

active

059239964

ABSTRACT:
A method is disclosed for forming alignment marks at the outer perimeter of wafers where they are not susceptible to much damage during chemical-mechanical polishing (CMP) process. Complete protection is provided by recessing the alignment mark into the substrate by etching. Recess etching is accomplished at the same time the isolation trenches are followed to delineate device areas. Thus, alignment marks are provided with a protective recess without extra steps. Furthermore, by forming alignment marks at the outer perimeter of the wafer, productivity is improved by providing maximum usage of wafer area for integrated circuits.

REFERENCES:
patent: 4981529 (1991-01-01), Tsujita
patent: 5198390 (1993-03-01), MacDonald et al.
patent: 5234868 (1993-08-01), Cote
patent: 5314843 (1994-05-01), Yu et al.
patent: 5401691 (1995-03-01), Caldwell
patent: 5523254 (1996-06-01), Satoh et al.
patent: 5556808 (1996-09-01), Williams et al.
patent: 5622899 (1997-04-01), Chao et al.
patent: 5668042 (1997-09-01), Bae
patent: 5700732 (1997-12-01), Jost et al.
patent: 5786260 (1998-07-01), Jang et al.
patent: 5801090 (1998-09-01), Wu et al.

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