Method to prevent adhesion of micromechanical structures

Details Method to prevent adhesion of micromechanical structures Method to prevent adhesion of micromechanical structures

1996-04-10

1998-06-30

Breneman, R. Bruce

Etching a substrate: processes

Etching of semiconductor material to produce an article...

216 11, 216 99, 1566571, 1566621, 437225, 437249, H01L 21302, B44C 122

Patent

active

057729026

ABSTRACT:
A method is provided for inhibiting stiction of suspended microstructures during post-release-etch rinsing and drying. The microstructures are shaped to include additional convex corners at regions of the released portion of the microstructure that can undergo substantial displacement toward the substrate. A stiction-inhibition method also includes incorporating clefts between the microstructure and adjacent field regions at regions of the microstructure which cannot undergo substantial displacement toward the substrate. Methods for inhibiting stiction are also provided wherein high-temperature rinse liquid is used and wherein a high-temperature anneal follows a rinsing step.

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