Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Patent
1996-03-25
1998-10-06
Niebling, John
Semiconductor device manufacturing: process
With measuring or testing
Electrical characteristic sensed
438530, H01L 2100, G01R 3126
Patent
active
058175369
ABSTRACT:
A method to monitor boron penetration and optimize process parameters in the fabrication of a semiconductor device have an n.sup.+ or a p.sup.- -polysilicon gate. The charge-to-breakdown Q.sub.BD value is used to monitor the boron penetration into the polysilicon/gate oxide interface. Values of Q.sub.BD for various values of process parameters are determined and optimized values for these process parameters are derived.
REFERENCES:
patent: 5023561 (1991-06-01), Hillard
patent: 5598102 (1997-01-01), Smayling et al.
patent: 5650336 (1997-07-01), Eriguchi et al.
Hao Ming-yin
Nayak Deepak Kumar
Rakkhit Rajat
Advanced Micro Devices , Inc.
Booth Richard A.
Niebling John
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