Method to minimize particulate induced clamping failures

Details Method to minimize particulate induced clamping failures Method to minimize particulate induced clamping failures

1999-01-08

2000-05-23

Bowers, Charles

Semiconductor device manufacturing: process

Gettering of substrate

438905, 438906, H01L 21322

Patent

active

060665467

ABSTRACT:
A method of manufacturing a semiconductor wafer in a chamber having a chuck and in which temperature changes in the chamber cause residual manufacturing materials to fall onto the surface of a production wafer placed on the chuck. When the temperature of the chamber is to be changed, a protection wafer is placed on the surface of the chuck. When the temperature has been changed, the protection wafer is removed from the surface of the chuck and a production wafer is placed on the surface of the chuck and clamped. When the process is complete the production wafer is removed and the protection wafer is placed on the chuck.

REFERENCES:
patent: 5434090 (1995-07-01), Chiou
patent: 5603892 (1997-02-01), Grilletto
patent: 5707498 (1998-01-01), Ngan
patent: 5746928 (1998-05-01), Yen
patent: 5865896 (1999-02-01), Nowak

Affiliated with

Also associated with

Rating

Method to minimize particulate induced clamping failures does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method to minimize particulate induced clamping failures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method to minimize particulate induced clamping failures will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1836633