Method to minimize iso-dense contact or via gap filling...

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

Reexamination Certificate

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C427S240000, C427S256000, C427S352000, C427S385500, C427S425000, C118S052000, C118S320000, C438S618000, C438S633000, C438S780000, C438S782000

Reexamination Certificate

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06849293

ABSTRACT:
A method for spin coating a polymeric material film upon a wafer rotatably mounted within a spin coater; the wafer having a surface, including the following steps. A first step of rotating the wafer on an axis perpendicular to the wafer surface while applying a predetermined amount of polymeric material while rotating the wafer at a rotational speed of from about 300 to 1200 rpm for from about 2.5 to 5 seconds to spread the polymeric material on the whole surface of the wafer. A second step of increasing the rotational speed of the wafer to about 5500 rpm for about 2.5 seconds. A third step of decreasing the rotational speed of the wafer to about 300 to 1200 rpm for about 2.5 seconds. A fourth step of increasing the rotational speed of the wafer to about 5500 rpm for about 20 seconds to form the polymeric material film having a predetermined thickness over the whole surface of the wafer.

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patent: 20030087535 (2003-05-01), Matsuura

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