Method to manufacture a universal footprint for a package...

Details Method to manufacture a universal footprint for a package... Method to manufacture a universal footprint for a package...

2007-08-14

2007-08-14

Ha, Nathan W. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Reexamination Certificate

active

11035918

ABSTRACT:
A semiconductor die package is disclosed. It may include a semiconductor die having a first surface and a second surface, and a leadframe structure. A molding material may be formed around at least a portion of the die and at least a portion of the leadframe structure. A solderable layer may be on the exterior surface of the molding material and the first surface of the semiconductor die.

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