Semiconductor device manufacturing: process – Semiconductor substrate dicing – Having specified scribe region structure
Reexamination Certificate
2005-03-16
2009-02-10
Pham, Thanhha (Department: 2894)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
Having specified scribe region structure
C438S401000, C257SE21561
Reexamination Certificate
active
07488669
ABSTRACT:
A method of making at least one marker (MX) for double gate SOI processing on a SOI wafer is disclosed. The marker has a diffracting structure in a first direction and the diffracting structure is configured to generate an asymmetrical diffraction pattern during use in an alignment and overlay detection system for detection in the first direction.
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Laidler David William
Loo Josine Johanna Gerarda Petra
Ponomarev Youri V.
Interuniversitair Microelektronica Centrum vzw (IMEC)
Knobbe Martens Olson & Bear LLP
Koninklijke Philips Electronics
Pham Thanhha
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