Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate
2007-08-28
2007-08-28
Trinh, Michael (Department: 2822)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
C438S052000, C438S668000, C257SE21297
Reexamination Certificate
active
10675587
ABSTRACT:
Embodiments of the present invention form a weight-compensating/tuning layer on a structure (e.g., a silicon wafer with one or more layers of material (e.g., films)) having variations in its surface topology. The variations in surface topology take the form of thick and thin regions of materials. The weight-compensating/tuning layer includes narrow and wide regions corresponding to the thick and thin regions, respectively.
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Doros Theodore
Seshan Krishna
Blakely , Sokoloff, Taylor & Zafman LLP
Intel Corporation
Trinh Michael
LandOfFree
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