Method to locate and eliminate manufacturing defects in a...

Details Method to locate and eliminate manufacturing defects in a... Method to locate and eliminate manufacturing defects in a...

2011-07-05

2011-07-05

Johnson, Christina (Department: 1742)

Plastic and nonmetallic article shaping or treating: processes

Laser ablative shaping or piercing

Reexamination Certificate

active

07972552

ABSTRACT:
A method for locating and eliminating defects on a substrate wafer includes illuminating a top surface of the substrate wafer with a first illumination source, illuminating a bottom surface of the substrate wafer with a second illumination source, forming an image of a portion of the top surface of the substrate wafer while the substrate wafer is illuminated by the first and second illumination sources, adjusting a contrast of the image to accentuate defects on the top surface of the substrate wafer, locating defects in the image, and ablating the defects on the top surface with a laser.

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Ihlemann, J., B. Wolff, P. Simon, “Nanosecond and Femtosecond Excimer Laser Ablation of Fused Silica” Applied Physics A. 54, 363-368, 1992.

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