Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
Patent
1992-02-21
1994-11-29
Nguyen, Viet Q.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
257754, 257768, 257770, 257773, 257776, H01L 2190
Patent
active
053693027
ABSTRACT:
The method for fabrication of semiconductor contacts resulting in rounded contact corners providing for increased step coverage includes depositing a glass layer over a substrate and heating the glass layer to reflow. The glass layer is patterned and etched to form a contact opening. A barrier layer is deposited, annealed, and selectively wet etched leaving the barrier layer only in the bottom of the contact opening. The glass layer is reflowed again to form rounded contact corners.
REFERENCES:
patent: 4361599 (1982-11-01), Wourms
patent: 4381215 (1983-04-01), Reynolds et al.
patent: 4458410 (1984-07-01), Sugaki et al.
patent: 4502209 (1985-03-01), Eizenberg et al.
patent: 4680612 (1987-07-01), Hieber et al.
patent: 4700465 (1987-10-01), Sirkin
patent: 4748490 (1988-05-01), Hollingsworth
patent: 4752813 (1988-06-01), Bhatia et al.
patent: 4772571 (1988-09-01), Scovell et al.
patent: 4807016 (1989-02-01), Douglas
patent: 4816879 (1989-03-01), Ellwanger
patent: 4897709 (1990-01-01), Yokoyama et al.
patent: 4926237 (1990-05-01), Sun et al.
patent: 4962414 (1990-10-01), Liou et al.
patent: 4966868 (1990-10-01), Murali et al.
patent: 5006916 (1991-04-01), Wills
patent: 5049975 (1991-09-01), Ajika et al.
patent: 5094981 (1992-03-01), Chung et al.
"Multiple Metal Film Structures for Wiring VLSI Circuit Chips", IBM, vol. 33, No. 1A, Jun. 1990, pp. 15-16.
Chen Fusen E.
Dixit Girish A.
Hill Kenneth C.
Jorgenson Lisa K.
Nguyen Viet Q.
Robinson Richard K.
SGS-Thomson Microelectronics Inc.
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