Method to fabricate passive components using conductive polymer

Details Method to fabricate passive components using conductive polymer Method to fabricate passive components using conductive polymer

2006-09-26

2006-09-26

Smith, Matthew (Department: 2823)

Semiconductor device manufacturing: process

Making passive device

C438S082000, C438S382000, C438S393000, C438S455000

Reexamination Certificate

active

07112502

ABSTRACT:
A method and structure for an integrated circuit chip has a logic core which includes a plurality of insulating and conducting levels, an exterior conductor level and passive devices having a conductive polymer directly connected to the exterior conductor level. The passive devices contain RF devices which also includes resistor, capacitor, and/or inductor. The resistors can be serpentine resistors and the capacitors can be interdigitated capacitors.

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PCT International Search Report, PCT/US02/16290, May 23, 2002, 5 pages.

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