Method to enhance micro-C4 reliability by reducing the...

Error detection/correction and fault detection/recovery – Data processing system error or fault handling – Reliability and availability

Reexamination Certificate

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Reexamination Certificate

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07836353

ABSTRACT:
A system for reducing an impact of hot spot pulsing of a semiconductor device including: first generating means for generating a plurality of local op-codes; a sequencer for augmenting customer op-codes with the plurality of local op-codes; selecting means for selecting one or more of the randomly arriving customer op-codes awaiting execution; monitoring means for tracking which of the one or more randomly arriving customer op-codes have been selected; separating means for separating the plurality of local op-codes from the one or more customer op-codes; storing means for storing one or more data related to the processing of the plurality of local op-codes and the customer op-codes; and second generating means for generating an output for a customer corresponding to that customer op-code while gainfully employing an output generated by local op-codes for system health monitoring purpose.

REFERENCES:
patent: 7711395 (2010-05-01), Oba
patent: 2009/0015278 (2009-01-01), Dang et al.
patent: 2009/0039911 (2009-02-01), Dang et al.
Hongfang Wang, Vibration Fatigue Experiments of SMT Solder Joint, Mar. 6, 2003, pp. 1143-1156, Shanghai, China, Elsevier Ltd.
Robert Darveaux, Reliability of Area Array Solder Joints In Bending, Amkor Technology, Inc.
Karl Puttlitz, Area Array Interconnection Handbook, pp. 506-520, Kluwer Academic Publishers.
Katsuaki Suganuma, Lead-Free Soldering In Electronics, pp. 188-192, Marcel Dekker, Inc., 2004, New York.

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