Method to eliminate corrosion in conductive elements

Details Method to eliminate corrosion in conductive elements Method to eliminate corrosion in conductive elements

1993-07-15

1994-12-27

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156665, 156666, 156638, 156651, 156667, 252 791, H01L 2100

Patent

active

053762355

ABSTRACT:
A semiconductor wafer is washed in a dilute phosphoric acid solution after the metal features have been patterned and etched, thereby removing substantially all of the residual oxide, chlorine, and/or fluorine contamination which remains on the features. This will substantially eliminate corrosion of the features. The phosphoric acid wash also substantially prevents voids from forming during a subsequent alloy step. The features can include bond pads, vias, contacts, interconnects, etc.

REFERENCES:
patent: 4432846 (1984-02-01), Honeycutt, III
patent: 4824757 (1989-04-01), Aono et al.
patent: 4999160 (1991-03-01), Lowrey et al.
patent: 5007981 (1991-04-01), Kawasaki et al.
patent: 5112743 (1992-05-01), Kamiya et al.
Freiberger et al., "A Novel Via Failure Mechanism in an Al-Cu/Ti Double Level Metal System", 1992, pp. 356-360.

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