Etching a substrate: processes – Masking of a substrate using material resistant to an etchant
Reexamination Certificate
2006-09-12
2006-09-12
Norton, Nadine (Department: 1765)
Etching a substrate: processes
Masking of a substrate using material resistant to an etchant
C216S046000, C216S059000, C216S051000
Reexamination Certificate
active
07105098
ABSTRACT:
New methods for fabrication of silicon microstructures have been developed. In these methods, an etching delay layer is deposited and patterned so as to provide differential control on the depth of features being etched into a substrate material. Compensation for etching-related structural artifacts can be accomplished by proper use of such an etching delay layer.
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Galambos Paul C.
Manginell Ronald P.
Mitchell Mary-Anne
Schubert W. Kent
Shul Randy J.
Bieg Kevin W.
Norton Nadine
Sandia Corporation
Tran Binh X.
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