Method, system, and computer program product for preparing...

Details Method, system, and computer program product for preparing... Method, system, and computer program product for preparing...

2007-10-02

2010-11-02

Rossoshek, Helen (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000, C716S030000, C716S030000, C716S030000, C716S030000, C430S014000, C430S030000

Reexamination Certificate

active

07827519

ABSTRACT:
Disclosed is an improved method, system, and computer program product for preparing multiple levels of semiconductor substrates for three-dimensional IC integration. Some embodiments utilize the process and design models to check and fabricate the insulating dielectric layer (IDL) separating the first and the second film stacks on separate substrates and then prepare the surface of the IDL to receive an additional layer of semiconductor substrate for further fabrication of the chips. Yet some other embodiments further employ the design and process models to ensure the IDL and the semiconductor substrate are sufficiently flat, or are otherwise satisfactory, so the three-dimensional integrated circuits meet the reliability, manufacturability, yield, or performance requirements. Yet some other embodiments further employ design and process models to place the vias connecting the multiple film stacks.

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