Method of writing identifying information on wafer

Details Method of writing identifying information on wafer Method of writing identifying information on wafer

2006-02-10

2010-10-26

Duda, Kathleen (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

C430S394000

Reexamination Certificate

active

07820366

ABSTRACT:
A method of writing identifying information comprises: the step of forming a metal film on a wafer; the step of forming a resist layer on the metal film; the step of exposing the resist layer by projecting a pattern for an alignment mark on the resist layer; the first development step of developing the resist layer; the step of exposing the resist layer by projecting a pattern for the identifying information onto the resist layer using the pattern formed in the resist layer in the first development step as a reference of a location; the second development step of developing the resist layer; the step of selectively etching the metal film using the resist layer as an etching mask; and removing the resist layer.

REFERENCES:
patent: 4670090 (1987-06-01), Sheng et al.
patent: 5733711 (1998-03-01), Juengling
patent: 6623911 (2003-09-01), Jong et al.
patent: 6924090 (2005-08-01), Hirooka
patent: 7354699 (2008-04-01), Hirooka
patent: 2003/0059726 (2003-03-01), Hirooka
patent: A 62-20116 (1987-01-01), None
patent: A-63-275115 (1988-11-01), None
patent: A-2-015612 (1990-01-01), None
patent: A 2002-184672 (2002-06-01), None
patent: A-2003-131391 (2003-05-01), None
patent: A-2003-140366 (2003-05-01), None

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