Method of wet cleaning a surface, especially of a material...

Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...

Reexamination Certificate

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C134S003000, C134S026000, C134S027000, C134S028000, C134S034000, C134S035000, C134S036000, C134S032000, C134S033000, C134S041000, C134S042000, C134S902000, C510S175000

Reexamination Certificate

active

11026186

ABSTRACT:
Method of wet cleaning a surface of at least one material chosen from silicon, silicon-germanium alloys, A(III)/B(V)-type semiconductors and epitaxially grown crystalline materials, such as germanium, in which method the following successive steps are carried out:a) the surface is brought into contact with an HF solution;b) the surface is rinsed with acidified, deionized water, then a powerful oxidizing agent is added to the deionized water and the rinsing is continued;c) optionally, step a) is repeated, once or twice, while optionally reducing the contacting time;d) step b) is optionally repeated, once or twice; ande) the surface is dried.Process for fabricating an electronic, optical or optoelectronic device, such as a CMOS or MOSFET device, comprising at least one wet cleaning step using the said cleaning method.

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