Method of wafer/substrate bonding

Details Method of wafer/substrate bonding Method of wafer/substrate bonding

2007-03-20

2007-03-20

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S456000, C438S457000, C438S458000, C438S459000, C438S406000, C257SE21089

Reexamination Certificate

active

10512711

ABSTRACT:
A method of bonding two components by depositing an amorphous and non-hydrogenated intermediate layer (2) on one of the components (1,4) and arranging the components (1,4) in spaced relationship with the intermediate layer (2) therebetween. The method further comprises heating one or both of the components (1,4) before bringing the components (1,4) into contact. Finally, a voltage is applied to the components (1,4) to create a permanent bond between the two components.

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