Method of utilizing fuses to select alternative modules in a sem

Details Method of utilizing fuses to select alternative modules in a sem Method of utilizing fuses to select alternative modules in a sem

1999-01-25

2000-11-28

Hardy, David

Semiconductor device manufacturing: process

Making device array and selectively interconnecting

Rendering selected devices operable or inoperable

438132, 438129, 438467, 438598, 438599, 438601, 438 6, 438 18, H01L 2182

Patent

active

061534501

ABSTRACT:
A semiconductor device according to the present invention is formed on a semiconductor chip and has a common module and a plurality of selectable modules. Each selectable module on the semiconductor chip performs a defined function and has a separate input power terminal. The device also has a voltage pad for connecting to a first voltage source having a first voltage level, so that the voltage pad supplies power to the input power terminal of each selectable module. The output of each selectable module may be connected to one common output pad, or alternatively, may be connected to a dedicated output pad. Also connected to each selectable module is a die/sort pad used for disconnecting a corresponding selectable module from the first voltage source. In the wiring between the first voltage source and the selectable modules, there is provided a plurality of fuses, each fuse having first and second terminals. The first terminal of the fuse is connected to the input power terminal of the corresponding selectable module and the corresponding die/sort pad. The second terminal of the fuse is connected to the voltage pad. Base on the customized specification provided, certain selectable modules may be made inoperable by disconnecting the input power. This is achieved by applying a second voltage source, such as a ground voltage, to one or more of the die/sort pads corresponding to the unused selectable modules.

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patent: 5970346 (1999-10-01), Liaw
patent: 5994170 (1999-11-01), Pedersen et al.

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