Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Patent
1995-06-19
1996-08-13
Niebling, John
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating selected area
205159, 205160, 205162, 205164, 205183, C25D 502, C25D 554, C23C 2800
Patent
active
055453082
ABSTRACT:
The present invention provides electronically conducting polymer films formed from photosensitive formulations of pyrrole and an electron acceptor that have been selectively exposed to UV light, laser light, or electron beams. The formulations may include photoinitiators, flexibilizers, solvents and the like. These solutions can be used in applications including printed circuit boards and through-hole plating and enable direct metallization processes on non-conducting substrates. After forming the conductive polymer patterns, a printed wiring board can be formed by sensitizing the polymer with palladium and electrolytically depositing copper.
REFERENCES:
patent: 5106473 (1992-04-01), Whitlaw et al.
patent: 5300208 (1994-04-01), Angelopoulos et al.
patent: 5368717 (1994-11-01), Gottesfeld et al.
Clarke Eric T.
Hitchens G. Duncan
Hodko Dalibor
Miller David L.
Murphy Oliver J.
Lynntech Inc.
Niebling John
Patterson B. Todd
Streets Jeffrey L.
Wong Edna
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