Method of using an interface layer for stacked lamination sizing

Details Method of using an interface layer for stacked lamination sizing Method of using an interface layer for stacked lamination sizing

1996-10-08

1999-02-02

Bowers, Jr., Charles L.

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Subsequent separation into plural bodies

156247, 156323, 156344, H01L 2130, H01L 2146

Patent

active

058664700

ABSTRACT:
A process for making multiple microelectronic ceramic substrates uses an interface layer between stacked layers of green sheets that are laminated with the interface layer, then fired to produce the ceramic substrates. The interface layer acts to protect the substrates, and to hold them together before firing, then thermally degrades at a desired point in the firing cycle to separate the individual substrates. The invention also includes the ceramic substrates produced by the method.

REFERENCES:
patent: 5171721 (1992-12-01), Nanataki et al.
patent: 5242867 (1993-09-01), Lin et al.
patent: 5278007 (1994-01-01), Nanataki et al.
patent: 5307759 (1994-05-01), Hakotani et al.
patent: 5662755 (1997-09-01), Miura et al.

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