Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1984-11-05
1986-01-28
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156643, 156655, 156656, 156667, 219121LJ, 219121LM, 338195, 427 531, 427102, B23K 900, H01C 1000, B44C 122, C23F 102
Patent
active
045669368
ABSTRACT:
A method for trimming precision resistors which includes forming a helical groove in a conductive film coating on a cylindrical core. Final trimming includes forming discrete circular depressions in the film coating by using a pulsed laser. This method enables the manufacture of precision resistors having a tolerance of 0.25% or better.
REFERENCES:
patent: 3916144 (1975-10-01), Schuermann
Briody Thomas A.
Goodman Edward W.
North American Philips Corporation
Powell William A.
Streeter William J.
LandOfFree
Method of trimming precision resistors does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of trimming precision resistors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of trimming precision resistors will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1304810