Method of treatment of porous dielectric films to reduce...

Details Method of treatment of porous dielectric films to reduce... Method of treatment of porous dielectric films to reduce...

2007-01-30

2007-01-30

Duda, Kathleen (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Removal of imaged layers

C430S322000, C430S311000, C134S001000

Reexamination Certificate

active

10412121

ABSTRACT:
A device, method, and system for treating low-k dielectric material films to reduce damage during microelectronic component cleaning processes is disclosed. The current invention cleans porous low-k dielectric material films in a highly selectivity with minimal dielectric material damage by first treating microelectronic components to a passivating process followed by a cleaning solution process.

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